Epoxy Resin Concrete Adhesive Glue for Vinyi Chip Flakes

Epoxy Resin Concrete Adhesive Glue for Vinyi Chip Flakes

Mainly used for the bonding of honeycomb board, corrugated board products, etc., but also for all kinds of metal, alumina ceramic liner, RBSIC liner, wood, porcelain, stone, and other decorative composite bonding.
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Description

Technical Parameters

By providing customers with world-class Alumina Ceramic Tiles, Alumina Ceramic Cyliner, Wear Resistant Panel, technical support and the highest level of service, we ensure our long-term success and prosperity with our customers. We will serve our customers wholeheartedly. Our enterprise spirit is, scientific management, truth-seeking, innovation, customer satisfaction and sustainable development. Through arduous and unremitting efforts, we have become an advanced enterprise with standardized governance, efficient management, mature culture, high degree of marketization and strong international management capabilities. At the time of our marketing network is all over the world, we provide timely, perfect and comprehensive sales service for all our customers, so that enterprises and customers are closely connected to create a better future together.

Epoxy resign

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Mainly used for the bonding of honeycomb board, corrugated board products, etc., but also for all kinds of metal, alumina ceramic liner, RBSIC liner, wood, porcelain, stone, and other decorative composite bonding. This product is convenient to use, suitable for scraping and painting in all directions, easy to operate, high adhesion strength after curing, curing without shrinkage, corrosion resistance, aging resistance.


High quality adhesive

High temperature resistant repair adhesive

Epoxy AB glue

Perform Index of High Tempearture Glue(Normal glue)

Item

Data

Testing Standard

Apperance

White(pale yellow) sticky paste

Eye-measurement

Proportion

A:B=1:1

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Bulk Density(g/cm3)

1.66~1.70

GB/13354-1992

Working Time (min/25℃)

60

GB/T7123.1-2002

Shearing Strength(Mpa)

≥ 10

GB/T7124-2008

Tensile Strength(Mpa)

65

GB/T6329-1996

Curing Condition (25℃)

24h

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Working Temperature(℃)

﹣60~120

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Photo show

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Since the establishment of our company, the primary goal has been to maintain the superior quality, excellent durability and high cost performance of our Epoxy Resin Concrete Adhesive Glue for Vinyi Chip Flakes. Under your trust, we will serve you wholeheartedly, welcome to patronize! Moreover, it's our honest and sincerity, which help us always be clients' first choice.

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