Epoxy Resin Glue
Description
Technical Parameters
Epoxy resign
Mainly used for the bonding of honeycomb board, corrugated board products, etc., but also for all kinds of metal, alumina ceramic liner, RBSIC liner, wood, porcelain, stone, and other decorative composite bonding. This product is convenient to use, suitable for scraping and painting in all directions, easy to operate, high adhesion strength after curing, curing without shrinkage, corrosion resistance, aging resistance.
High quality adhesive
High temperature resistant repair adhesive
Epoxy AB glue
Perform Index of High Tempearture Glue(Normal glue) | ||
Item | Data | Testing Standard |
Apperance | White(pale yellow) sticky paste | Eye-measurement |
Proportion | A:B=1:1 | / |
Bulk Density(g/cm3) | 1.66~1.70 | GB/13354-1992 |
Working Time (min/25℃) | 60 | GB/T7123.1-2002 |
Shearing Strength(Mpa) | ≥ 10 | GB/T7124-2008 |
Tensile Strength(Mpa) | 65 | GB/T6329-1996 |
Curing Condition (25℃) | 24h | / |
Working Temperature(℃) | ﹣60~120 | / |
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